NeoPhotonics Corporation

Photonic Integrated Curcuits

Operating Factories

Shareholders in Portfolio Company 
RUSNANO, institutional investors, private investors

Industry Sector 
Optics and Electronics

Production Location 
Moscow, Russia

Investment Started:  2012

Total Budget

2.09  bln rubles
Co-investment by RUSNANO
2.09  bln rubles

Design and manufacture of photonic integrated circuits and PIC-based modules and subsystems

NeoPhotonics designs and manufactures a broad range of optoelectronic devices that enable data transmission at speeds of 10 Gbps to 100 Gbps. Products from NeoPhotonics permit dynamic allocation of bandwidth to compensate for volatile traffic patterns and provide more devices with high bandwidth wireline and wireless network connections.

NeoPhotonics products simplify optical network implementation by delivering high levels of integration through PIC solutions, which combine multiple discrete elements, in some cases over one hundred, on a single chip. NeoPhotonics’ innovative PIC technology allows producers of high-speed communications equipment to create faster, more efficient, more compact solutions. PIC-based devices can incorporate many more functional elements than systems based on discrete components. With more functional elements, packaging and interconnection costs fall and data transmission efficiency and reliability rise.

In May 2013 NeoPhotonics Corporation opened a design center and a sales office in Russia. The Russian design center and the production complex now being built will develop and produce equipment for broadband networks for the Russian telecommunication industry and for markets in the CIS and Eastern Europe. NeoPhotonics expects to commission its Russian manufacturing plant in 2015.

Areas of Application

  • High-speed communications systems for transmission of large-volume data

Market

  • Producers of telecommunications equipment

Competitive Advantages

  • Dynamic allocation of bandwidth to accommodate traffic volatility
  • High-speed data transmission
  • Lower packaging and interconnection costs
  • Highly reliable operation

NeoPhotonics has developed innovative PIC technology over fifteen years by utilizing a set of proprietary design elements that provide optical functionality on a silicon chip. These proprietary design tools and the NeoPhotonics design-for-manufacturing techniques closely align the Company’s design process with precision nanoscale, vertically integrated manufacturing and testing capabilities. NeoPhotonics technology and manufacturing expertise enable the Company to deliver repeatable, well-characterized products at high yields. PIC devices produced by NeoPhotonics can incorporate many more functional elements than can discrete components, thereby eliminating packaging and interconnection costs, improving reliability and uniformity. In addition, the costs of PIC-based components are driven by silicon economics, such that the incremental costs of producing an incremental chip are much less than that of a discrete component with individual packaging and interconnection.