Quantenna Communications Named CES Innovations 2014 Design and Engineering Award Honoree

14 November 2013

Quantenna Communications, the leader in ultra-reliable Wi-Fi networking for whole-home entertainment, announced today announced that it has been named an International CES Innovations 2014 Design and Engineering Awards Honoree for its Quantenna QSR1000 wave 2 802.11ac chipset, the world’s first 802.11ac wave 2 offering with multi-user MIMO (MU-MIMO). Products entered in this prestigious program are judged by a preeminent panel of independent industrial designers, independent engineers and members of the trade media to honor outstanding design and engineering in cutting edge consumer electronics products across 29 product categories.

The QSR1000 combines Quantenna’s industry-first 4x4 architecture with MU-MIMO technology, dynamic-digital beamforming and support for four spatial streams to deliver unsurpassed performance, range, reliability and coverage. The only wave 2 802.11ac chipset, Quantenna’s 1.7Gbps QSR1000 technology transmits faster, reaches farther and serves more devices more reliably than any other Wi-Fi solution ever created. This makes Quantenna’s 802.11ac solution ideally suited to simultaneously and flawlessly stream multimedia-rich content to multiple devices demanding wire-like quality—including everything from IPTV to full 1080p and 4K Ultra HD.

“Quantenna is elated to accept this award four years running for our innovation in consumer Wi-Fi technology,” said Dr. Sam Heidari, CEO, Quantenna. “We are consistently redefining the possibilities of wireless in the home, and are proud to say that nothing comes close to delivering the level of performance, quality and cost effectiveness that we have achieved in our new wave 2 MU-MIMO 802.11ac chipset.”

The prestigious Innovations Design and Engineering Awards are sponsored by the Consumer Electronics Association (CEA)®, the producer of the International CES, the global gathering place for all who thrive on the business of consumer technology, and have been recognizing achievements in product design and engineering since 1976.

The QSR1000 4x4 MU-MIMO 802.11ac chipset will be demonstrated in customer products and partner reference designs in Quantenna’s Venetian meeting suite at the 2014 International CES, which runs January 7–10, 2014 in Las Vegas, Nevada. Honorees will also be displayed at CES Unveiled: The Official Media Event of the International CES from 4–7 p.m. on Sunday, January 5 in South Seas Ballroom C at Mandalay Bay.

The Innovations entries are judged based on the following criteria:

  • Engineering qualities, based on technical specs and materials used
  • Aesthetic and design qualities, using photos provided
  • The product’s intended use/function and user value
  • Why the product deserves the Innovations award, including specifics regarding its unique/novel features and features that consumers would find attractive
  • How the design and innovation of this product directly compare to other products in the market place
  • Products chosen as an Innovations honoree reflect innovative design and engineering of the entries. Examples may include the first time various technologies are combined in a single product or dramatic enhancements to previous product designs.

Innovations 2014 Design and Engineering honoree products are featured on CESweb.org/Innovations, which lists product categories, as well as each product name, manufacturer information, designer, description, photo and URL. To set up a time to meet with Quantenna during CES, please contact quantenna@lewispr.com.

Source: Business Wire, 12.11.2013