RUSNANO to Invest in Production of Substrates and Panels for LED Assembly

01 March 2010


The Supervisory Council of RUSNANO has authorized financing for a project titled Establishment of Production of Panels with High Thermal Conductivity for Assembly of Bright Light-Emitting Diodes Based on Technology for Obtaining a Nanoporous Layer of Al2O3 on the Aluminum Wafer through Anodization. The project company will produce multilayered panels for LED assembly. It will produce, as well, substrates and panels for assembling microprocessors, transistors, and other semiconducting devises, both multi- and single-layer.

The project is based on patented technology, ALOX, developed by Israeli company Micro Components Ltd., which initiated the creation of new production. Substrates produced with ALOX technology contain two basic parts: the carrying layer of aluminum or copper and the dielectric material. It is the dielectric material, which has the nanoporous structure, that determines the competitive advantages of the substrates in comparison with ceramic substrates or panels with directly bonded copper. Thus, with pores of 65 nm to 90 nm and suffusion with special nanofillings, it is possible to achieve high thermal conductivity, to 200 W/m*K, high dielectric breakdown voltage, more than five KV, good thermomechanical optical properties, plus a comparatively low price.

The total budget for the project is 1.085 billion rubles. RUSNANO will contribute 120 million rubles to owners’ equity of the project company and guarantee obligations to 250 million rubles. The coinvester will contribute 132 million rubles. MCL, the project initiator, will invest 30 million rubles in monetary resources and 328 million rubles in nonmaterial assests—licenses for the use of the ALOX technology. In addition, 475 million rubles will be attracted in the form of a bank loan.

Sales of the project company in 2015 are forecasted at 2.796 billion rubles. Specialists at RUSNANO estimate that in 2015 the market for multilayer panels will by $3 billion and for single-layer panels—$900 million. That same year LED modules will have a market of $9.4 billion. The project company is targeting its share of the global market for multi-layer panels for LED use at four percent.

Panels produced using the ALOX technology have successfully completed tests for thermal reliability and are now being considered for use by the world’s largest LED and LED equipment producers. Russian companies OptoGaN and Sevetlana-Optoelectronics are also evaluating their use. 

MCL specializes in engineering and production of panels and substrates with high thermal conductivity. Its work is based on a number of innovative technological solutions that company experts have developed for the electronics industry. The ALOX technology has been introduced into production in Israel (in pilot production at MCL Ltd. ) and Malysia (full-scale production by AMS). Baltic Manufacturing Solutions is the technological partner for the project in the Russian Federation.

MCL is engaged in the development and production of ceramic  and metal-based advanced multilayer packages and substrates for the electronics industry. Its main applications are in advanced packaging of high pin-count components, System in Package (Russia), and high-power packaging. The products have superior thermal properties. These are based on an advanced multilayer substrate with a high content of aluminum embedded in a ceramic-based dielectric matrix. MCL—Micro Components Ltd.—has developed a revolutionary, proprietary substrate technology called ALOX.